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Implant-level connection: Direct fit to the implant
With its M1
triangular Ø5
where accurate and distortion-free modelling of implant-supported restorations is a critical requirement
BIONIKA DI UF, Implant analog for digital scan Diameter:Ø 3 mm Implant-level connection: Direct fit toBrand characteristics The BIONIKA DI UF implant system is compatible with the DIO UF platform and features an advanced conical connection (Conical Connection) combined with a hexagonal fit, ensuring micromovement free load transfer and exceptional stability. The 22 cone angle directs forces deep into the implant body, reducing cortical bone stress and promoting long term osseointegration. The spirally micro grooved, self locking, and self compressing
