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Ships within 48 hours · Estimated delivery Aug 1 - Aug 6
Imaging in both secondary and back scattered mode is very high
Removable pushrods for easy loading are provided
in 6" wafer carrier
Thick-Thin Bar
TESPA-V2-SS Diamond & DLC Coating Imaging in both secondary andTESP V2, SUPERSHARP, 10 PACK DESCRIPTION Pack of 10 High quality etched silicon probes with backside Aluminum reflex coating, for TappingMode and other non contact modes. Combines the high consistency of the V2 design with a high aspect ratio, supersharp tip guaranteed by Bruker's proprietary process. Unmounted for use on standard AFMs.
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